AURUNA® 559 Fine Gold Electrolyte

AURUNA® 559 Fine Gold Electrolyte

Neutral high-speed electrolyte for selective gold-plating

AURUNA® 559 is used for the very fast deposition of semi-bright to satin fine gold coatings with excellent bonding and soldering properties. The neutral fine gold electrolyte was specifically developed for use in high-speed equipment for selective goldplating (spray and flow lines, jet and spot plating).

Maximum applicable current density and therefore plating speed as well essentially depend on the electrolyte agitation at the parts (flow velocity), i.e. on the type of equipment used. A high flow velocity allows a high plating speed. For achieving good adhesion, on nickel and nickel alloys in particular, the parts should be strike gold-plated in the AURUNA® 580 gold strike electrolyte. The layers exhibit outstanding bondability and excellent temperature resistance. They are ductile and smooth and light-yellow even at high layer thickness (greater than 20 μm).

Electrolyte characteristics

Electrolyte type


Metal content

16 (14 - 16) g/l Au

pH value

7.5 (7.3 - 7.5), measured at 25 °C

Operating temperature

70 (70 - 75) °C

Current density range

10 - 25 A/dm²

Plating speed

Approx. 6 - 15 μm/min

Anode material

Pt-Ti (type PLATINODE® Pt/Ti)

Coating characteristics


Fine gold


99,9 wt. % Au

Colour of deposit

Light yellow


Silk-matt to semibright


100 HV

Max. coating thickness

Approx. 19 g/cm³


  • Satin fine gold coatings
  • For high-speed applications
  • High current densities possible (10 – 25 A/dm²)
  • High plating speeds (up to 15 μm/min)
  • Excellent bonding and soldering properties
  • The coatings are RoHS compliant
  • Classification according to ASTM B-488-01 Type I-II, Code C-D


  • Semiconductors


  • Produktblatt-auruna-559-en-screen-20190430.pdf

Your contact person

Markus Legeler

Manager Sales International
T: +49 7171 607 204
F: +49 7171 607 316

Find a representative in your region


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