Thru-cup® EVF-N Copper Via Filling Electrolyte
Additives for acid copper via filling
Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating technology for blind via filling and simultaneous through-hole plating. The blind via hole filling characteristics for holes with diameters less than 150 μm are excellent. Thru-cup EVF-N works with three additives which can be easily controlled by CVS. Via filling performance is not influenced by electrolyte ageing. The plated copper film has an excellent thickness distribution.
- Thermal management enhancement
- Higher interconnect density in HDI PCB
- Long term reliability of the assembly and packaging operation
The information and statements contained herein are provided free of charge. They are believed to be accurate at the time of publication, but Umicore makes no warranty with respect thereto, including but not limited to any results to be obtained or the infringement of any proprietary rights. Use or application of such information or statements is at the user´s sole discretion, without any liability on the part of Umicore. Nothing herein shall be construed as a license or recommendation for use, which infringes upon any proprietary rights. All sales are subject to Umicore´s General Conditions of Sale and Delivery.