EPIG process

Electroless palladium and semi-autocatalytic gold plating

Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.

Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations.


  • Nickel free coating
  • Thin and very uniform electroless deposition
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability


  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design

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Questions about the product?

Markus Legeler

+49 7171 607 204

For inquiries and additional information
please contact

Umicore AG & Co. KG
Rodenbacher Chaussee 4
63457 Hanau-Wolfgang

Tel.: +49 (6181) 59 6005
Fax: +49 (6181) 59 2970
Email: chemistry@umicore.com
Website: www.chemistry.umicore.com

The information and statements contained herein are provided free of charge. They are believed to be accurate at the time of publication, but Umicore makes no warranty with respect thereto, including but not limited to any results to be obtained or the infringement of any proprietary rights. Use or application of such information or statements is at the user´s sole discretion, without any liability on the part of Umicore. Nothing herein shall be construed as a license or recommendation for use, which infringes upon any proprietary rights. All sales are subject to Umicore´s General Conditions of Sale and Delivery.