Electroless palladium, electroless nickel and semi-autocatalytic gold plating
Umicore's ENEPIG process provides an universal finish to the PCB industry with excellent wire-bonding performance and the highest degree of solder joint reliability (SJR) with lead-free SAC 305 alloy. The palladium slows the diffusion of tin into the nickel resulting in a minimum thickening of the nickeljtin IMC (= intermetallic compound), even following thermal stress of 1000 hours at 150 °C.
The possible use of unique semi-autocatalytic gold electrolyte Gobright® TWX-40 also enables to deposit even thicker gold layers with very uniform thickness distribution depending on customer requirements. The combination of electroless processes (nickel and palladium) and the final gold plating with this special type of electrolyte ensures a corrosion-free final finish system for highend applications and mixed assembly processes on same surface.
Moreover ENEPIG films are less expensive in comparison to electrolytic or electroless bondable gold like ENAG (= Electroless nickel + Autocatalytic gold) and additionally comply with latest RoHs and WEEE regulations.
The information and statements contained herein are provided free of charge. They are believed to be accurate at the time of publication, but Umicore makes no warranty with respect thereto, including but not limited to any results to be obtained or the infringement of any proprietary rights. Use or application of such information or statements is at the user´s sole discretion, without any liability on the part of Umicore. Nothing herein shall be construed as a license or recommendation for use, which infringes upon any proprietary rights. All sales are subject to Umicore´s General Conditions of Sale and Delivery.