Imprint DIG process | Electroplating

DIG process

DIG process

Plating of direct immersion gold

Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance.

Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding.

Electrolyte characteristics

Electrolyte type

Semi autocatalytic

Metal content

1.2 (1.0 - 1.4) g/l Au

pH value

7.2 (7.0 - 7.4)

Operating temperature

80 (78 - 82) °C

Deposition rate

0.15 μm / 20 min at 80 °C

Coating characteristics

Coating

Fine gold

Purity

99.9 wt %

Colour of deposit

Yellow

Recommended thickness

0.1 - 0.3 μm

Advantages

  • Nickel free coating
  • Deposits with high HF performance
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability
  • Low plating cost due to few process steps

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design

Downloads

  • Produktblatt-umicore-dig-en-screen-20190424.pdf

Your contact person

Markus Legeler

Manager Sales International
T: +49 7171 607 204
F: +49 7171 607 316
Email

Find a representative in your region

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