AURUNA® 8100 Gold Cobalt Electrolyte
High-speed electrolyte for hard gold coatings
AURUNA® 8100 is used for depositing hard gold coatings in special high-speed equipment. The weakly acidic high-speed electrolyte has a wide operating range with easy bath maintenance and extremely high plating speed.
AURUNA® 8100 was specifically developed for the automatic high-speed gold-plating in equipment for selective plating and continuously working reel-to-reel lines. Due to vigorous electrolyte agitation (flow, spray), it allows the working at high current densities with stable long-time behaviour. It can be also operated as a gold strike electrolyte.
The deposits are solderable, low in pores, ultra-bright, hard and abrasion-resistant. They have a constantly low contact resistance. Therefore the electrolyte is excellently suitable for the gold-plating of electronic components such as connectors, contacts and edge connectors on printed circuit boards.
The optional use of the AURUNA® Inhibitor 2 offers the possibility of a reduced gold consumption of up to 15%. The inhibitor allows sharp borderlines - this reduces the size of the run-off area. Of course, the layer properties remain unaffected. The inhibitor can be removed without any residue after the plating by cleaning with activated carbon.
The information and statements contained herein are provided free of charge. They are believed to be accurate at the time of publication, but Umicore makes no warranty with respect thereto, including but not limited to any results to be obtained or the infringement of any proprietary rights. Use or application of such information or statements is at the user´s sole discretion, without any liability on the part of Umicore. Nothing herein shall be construed as a license or recommendation for use, which infringes upon any proprietary rights. All sales are subject to Umicore´s General Conditions of Sale and Delivery.