Thru-cup® EVF-N Copper Via Filling Electrolyte
Thru-cup® EVF-N Copper Via Filling Electrolyte
Additives for acid copper via filling
Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating technology for blind via filling and simultaneous through-hole plating. The blind via hole filling characteristics for holes with diameters less than 150 μm are excellent. Thru-cup EVF-N works with three additives which can be easily controlled by CVS. Via filling performance is not influenced by electrolyte ageing. The plated copper film has an excellent thickness distribution.
Application Features
- Thermal management enhancement
- Higher interconnect density in HDI PCB
- Long term reliability of the assembly and packaging operation
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Advantages
- Excellent blind via hole filling characteristics
- Suitable for panel and pattern plating with simultaneous through-hole plating
- Long electrolyte lifetime
- Excellent thickness distribution of the plated copper film
- Concentrations of all additives can be analysed by cyclic voltammetry (CVS)
Applications
- IT products
- Consumer electronics
- Automotive applications
Needed Additives and Optional Products
- EVF-2A-10X
- EVF-2B-2X
- EVF-N
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