Direct Immersion Gold (DIG) also for bonding at room temperature

Electroplating

The problem of gold in bonding processes is widely known: As a rule, a minimum substrate temperature of 120 °C is necessary to achieve a good bond. These high temperatures have a negative effect on the materials used in the assembly. Therefore, especially in areas with complex products, room temperature bonding in the ball/wedge or wedge/wedge process is aimed for.

Application report shows the potential of our DIG-process

DIG stands for Direct Immersion Gold and means that a gold layer is deposited directly onto the copper of the PCB. Besides the compatibility with aluminium and gold wire and the nickel-free system, especially the good results at room temperature are a strong argument for the use of our DIG process.

For more details, read the comprehensive application report from Bond IQ, in which our DIG layer is analysed at different temperatures.

  • Application Report: Ball/Wedge wire bonding with gold wire on a Direct Immersion Gold (DIG) surface for printed circuit boards

    Quelle: www.bond-iq.de 

Further technical reports for download

In our technical reports section you will find further articles on our products from international trade magazines and books. We invite you to browse for articles that are relevant to you.

Further information

You would like to receive information or a non-binding offer for our DIG process? Andreas Groß is looking forward to hearing from you:

Andreas Gross
Division Manager PCB Applications

E-Mail: andreas.gross@eu.umicore.com 
Phone: +49 7231 4405 516

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