Final Finishing

Enhancement of fine pattern ability

Would you like to enhance the fine pattern ability on your printed circuit boards? We offer nickel-free processes such as EPIG (Electroless Palladium Immersion Gold) and ISIG (Immersion Silver Immersion Gold).

Optimise your layer characteristics: Rely on innovative solutions for proven processes such as ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold).

By the way: It goes without saying that the best possible solderability and bondability are a matter of course for us.

Please note: Here you may find just a part of our product range. We may have more processes for your requirements, which we could discuss together in more details. Please contact us.