Thru-cup® EVF-N
Copper Via Filling Electrolyte

Additives for acid copper via filling

 

Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating
technology for blind via filling and through-hole plating. The blind via hole filling characteristics for holes with diameters less than 150 μm are excellent. Thru-cup EVF-N works with three additives which can be easily controlled by CVS.
Via filling performance is not influenced by electrolyte ageing. The plated copper film has an excellent thickness distribution.

Your advantages:

  • Excellent blind via hole filling characteristics
  • Suitable for panel, pattern and through-hole plating
  • Long electrolyte lifetime
  • Excellent thickness distribution of the plated copper film
  • Concentrations of all additives can be analysed by
    cyclic voltammetry (CVS)
Thru-cup<sup>®</sup> EVF-N is used for copper via filling in PCB for smart phones, camcorders, mobile phones, digital cameras, etc.

Thru-cup® EVF-N is used for copper via filling in PCB for smart phones, camcorders, mobile phones, digital cameras, etc.

Applications

  • IT products
  • Consumer electronics
  • Automotive applications