Thru-cup® EVF-N
Copper Via Filling Electrolyte

Additives for acid copper via filling

 

Thru-cup® EVF-N is a new additive system for electrolytic acid copper plating on PCB. It is used in panel and pattern plating technology for blind via filling and simultaneous through-hole plating. The blind via hole filling characteristics for holes with diameters less than 150 μm are excellent. Thru-cup EVF-N works with three additives which can be easily controlled by CVS. Via filling performance is not influenced by electrolyte ageing. The plated copper film has an excellent thickness distribution.

Application Features

  • Thermal management enhancement
  • Higher interconnect density in HDI PCB
  • Long term reliability of the assembly and packaging operation

Your advantages:

  • Excellent blind via hole filling characteristics
  • Suitable for panel and pattern plating with simultaneous through-hole plating
  • Long electrolyte lifetime
  • Excellent thickness distribution of the plated copper film
  • Concentrations of all additives can be analysed by cyclic voltammetry (CVS)
Thru-cup<sup>®</sup> EVF-N is used for copper via filling in PCB for smart phones, camcorders, mobile phones, digital cameras, etc.

Thru-cup® EVF-N is used for copper via filling in PCB for smart phones, camcorders, mobile phones, digital cameras, etc.

Applications

  • IT products
  • Consumer electronics
  • Automotive applications