EPIG process
Electroless Palladium and Immersion Gold plating

Electroless palladium and semi-autocatalytic gold plating

 

Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.

Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations.

Your advantages:

  • Nickel free coating
  • Thin and very uniform electroless deposition
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability
EPIG as final finish for advanced assembly processes on HDI substrates, e.g. for copper and silver bonding technologies in telecommunication industry.

EPIG as final finish for advanced assembly processes on HDI substrates, e.g. for copper and silver bonding technologies in telecommunication industry.

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design