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EPIG process

EPIG process

Electroless palladium and semi-autocatalytic gold plating

Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.

Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations.

Advantages

  • Nickel free coating
  • Thin and very uniform electroless deposition
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design

Downloads

  • Produktblatt-umicore-epig-en-screen-20190417.pdf

Your contact person

Markus Legeler

Markus Legeler

Manager Sales International
T: +49 7171 607 204
F: +49 7171 607 316
Email

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Our goals for the next Years

Umicore RISE Strategy 2030