Cu Filling for Through Holes & Blind Micro Vias

Cu Filling for Through Holes & Blind Micro Vias

Cu filling for through holes & blind micro vias is becoming increasingly important: HDI-circuit boards are becoming more and more complex; the packing density is growing. New structures change the PCB design, which also increases the requirements for coatings at through holes and blind micro vias.

We offer the latest copper plating technologies. Three additives are responsible for the electrolyte maintenance. They are all CVS-analysable and ensure an optimum degree of copper filling of through holes and blind micro vias.

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Please note: Here you may find just a part of our product range. We may have more processes for your requirements, which we could discuss together in more details. Please contact us.